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Plating techniques

Plating by (galvanic) electrodeposition

The most commonly used plating method, plating by electrodeposition requires electrical conductivity from the plated object. Depending on the plating and application, the thickness of the plating varies between 0.1µm-60µm.

Chemical plating

This plating method is also suitable for non-conductive objects. Nickel and copper are the most common chemical platings. The advantages of chemical plating are even growth and good penetration.

Brush plating

An electroplating method which doesn’t require the plated part to be submerged into electrolyte.

Electroforming

This specialized method can be used to manufacture objects that would be impossible to produce using traditional processing methods. Electroformed platings can be up to several millimeters thick. The method’s applications include press moulds for records and CDs, microwave tubes and precision press moulds.

Selective plating

Selective plating is used for plating only certain parts of an object. This method can also be applied to physical vapour deposition.

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